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Cutting, Abrasive and Polishing Media

Thanks to its exceptional hardness, its sharp edges and brittleness, SiC ranks alongside corundum as the main material for the production of ceramic- or synthetic-bonded abrasive wheels, papers and cloths. It is used for machining all solid materials such as hard metals, cast iron, copper, brass, aluminium, zinc, glass, marble, granite, coal, plastics and wood.

In loose form too, SiC is used to grind and cut glass, marble and granite. Silicon carbide grades are used in loose form for machining glass and for lapping metallic workpieces
as well as for cutting stone blocks with cable saws. From coarse grades (several mm) down to
ultrafine grades (several µm), SiC can be used in loose or bonded form.

ESK-SiC for bonded abrasives and loose grinding


Macro Product information (particle size distribution) F4–F220

Micro Product information (particle size information) F230–F1200

Micro JIS Product information (particle size distribution) #240–#8000


ESK-SiC for abrasives on substrate


Macro Product information (particle size distribution) P12–P220

Micro Product information (particle size distribution) P240–P1200

Micro Product information (particle size distribution) P1500–P2500


ESK-SiC for wire saws


Carefully in corn grain size and thinner than an average hair of a human being, the classified SiC suits as a premium cutting agent for precision wire sawing of thin disks made from mono or multi crystalline silicon for the photovoltaic or electronics industry.